Recent Work
Softening implantable bioelectronics: Material designs, applications, and future directions, Biosensors and Bioelectronics 258, 116328 (2024).
Body-temperature softening electronic ink for additive manufacturing of transformative bioelectronics via direct writing, Science Advances 10, eadn1186 (2024).
Skin preparation–free, stretchable microneedle adhesive patches for reliable electrophysiological sensing and exoskeleton robot control, Science Advances 10, eadk5260 (2024).
A temperature-responsive intravenous needle that irreversibly softens on insertion, Nature Biomedical Engineering 8, 963-976 (2024).
Highly deformable double-sided neural probe with all-in-one electrode system for real-time in vivo detection of dopamine for parkinson's disease, Advanced Functional Materials 34, 2311436 (2024).
Welcome
Our mission is to invent the future generation “soft” bio-integrated electronics and systems for advancing healthcare and biomedicine. Research areas in the Jeong Group include design and fabrication of flexible and stretchable electronics, photonic microsystems, and microfluidic devices for various applications such as health/wellness monitoring, disease diagnosis and therapy, prosthetics, human-machine interfaces, and brain research. We pursue interdisciplinary approach, involving knowledge and techniques from electrical engineering, materials science and engineering, biomedical engineering, and physics. Our interests lie in developing wearable skin electronics systems and implantable soft devices for the brain and heart.
